In collaboration with leading IC and MEMS foundries and pilot lines, SIWAVE has established a consortium of micro-fabrication and R&D lines to partner in our efforts.
World Leading Manufacturing Capabilities
Material Compatibility covers C-SOI, Silicon-based III-V materials, magnetic materials, piezoelectric materials, Porous silicon materials
Process Compatibility enables Surface silicon processing, bulk silicon processing, 3D microfabrication, wafer bonding technologies
System level integration includes CMOS compatible MEMS, RF, Silicon Photonics, Power devices, micro power harvesting devices and battery, microfluidics modules
Seamless MP Compatibility with the production capabilities of SIWAVE’s foundry partners